About Conference
What to expect from IACHSSAbout IACHSS
The 4th International Academic Conference on Humanities and Social Sciences is a must-attend event for the academic community. Join us on the 08-10 of May in the dynamic city of Milan. Previously hosted in Germany and Italy, IACHSS continues to recruit top speakers in the field, to showcase findings from the latest research, and to provide premier networking opportunities.
Scientists, researchers, members of the academia, non-profits, and government organisations from all over the world will come together for cross-border learning and exchange of ideas. Discover the latest trends and challenges in the industry, network with the leading minds, and share your knowledge with members of the community. Finally, spend a day exploring Berlin on a free tour we’ll be organising for all participants.
HOW YOU CAN BENEFIT FROM IACHSS 2020
APPLY TO SPEAK
Take advantage of the international environment of the event and present your research to the diverse and vibrant community of academics, students, and researchers. Please note that due to the limited number of presentation slots, we strongly encourage early submission.
PUBLISH YOUR PAPER
IACHSS is the perfect publishing platform for your next research paper. All accepted research papers will be published and indexed in the conference proceedings. All accepted abstracts will be published in the conference abstract book with ISBN.
PRESENT YOUR POSTER
In addition to oral presentations, the event will feature posters from top academics in the industry. Apply to present your poster at this premier social sciences, humanities and education conference.
NETWORK WITH PEERS
The event is attended by thought leaders, influencers, students, and other members of the academia from all over the world. Learn about their challenges and discuss solutions in the highly engaging environment of the conference.
DO A VIRTUAL PRESENTATION
Can’t join the event in-person? Apply to do a virtual presentation. Share your knowledge and experience and receive event documentation.
EXPLORE Milan
We will host a free tour for the participants of the conference around the majestic city of Milan. Its rich history and captivating architecture make it one of the most popular conference locations in the world.
CONFERENCE TOPICS
The conference is seeking submissions related to the following conference topics:
Humanities and Culture Studies, Society, Education, Communication, Politics, Law.Other related topics will also be considered.
Paper Submission Deadline
14 April, 2020
1st Early Registration Deadline
17 Dec 2019
2nd Registration Deadline
21 Feb 2020
Late Registration Deadline
24 April 2020
City Tour
We would also like to offer the participants a one-day city tour free of charge. Great chance for participants to mingle around as well as appreciate the city of Milan famous for its vibrant culture, architecture, Art scenes and excellent cuisines. organizing committee will offer the participants a city tour free of charge.
We look forward to see you all on May 08th to 10th in lively Milan.
PAPER PUBLICATION OPPORTUNITY
The 4th International Academic Conference on Humanities and Social Sciences offer a unique opportunity to get your work published and viewed by hundreds of thousands of peers, students, and other members of the academia around the world.
All accepted research papers will be published and indexed in the conference proceedings.
Each Paper will be assigned Digital Object Identifier (DOI) from Cross Ref.
The proceedings shall be submitted to Google Scholar for Indexing.
The Conference Proceedings will be published in the conference proceeding with an ISBN in a soft form.
All papers have publication opportunity in ISI and Scopus indexed journals.
All papers have publication opportunity in various indexed international journal.
All accepted abstracts will be published in the conference abstract Proceedings ISBN. All full papers sent for conference proceedings will be accepted through a double-blind review process and will be published electronically in proceedings with a DOI number.
